Not known Details About Noohapou
Not known Details About Noohapou
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The POU3500 program gives dynamic temperature Charge of the procedure chamber cathode / electrode / anode and will be synchronized with any etch course of action.
Instrument & TCU computer software calibration methods vary exterior exam products not applied on a regular basis for verifying
With all the POU3500, you could realize unprecedented leads to etch general performance, chamber uptime, reduced cost of ownership and fab Place utilization – all whilst increasing your method trustworthiness.
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LAUDA-Noah will, for just a purchaser's retrofit evaluation, keep an eye on and change its fluid temperature Command profiles to match an existing TCUs' as a way to ensure a easy system integration via DAQ.
The accuracy with the POU 3300 allows for unbiased control of the process fluid temperature to the wafer chuck within +/- 0.one °C of set position, and also the quickly response time in the process makes it possible for for optimum wafer-to-wafer repeatability throughout the etch system.
All static TCUs demand extra cooling & heating capacities because of their quite substantial system fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Handle method is fewer than 1 gallon.
While using the POU3300, you'll be able to attain unparalleled brings about etch performance, chamber uptime, lowered cost of ownership and fab Place utilization – all even though improving your process reliability.
the info pertains into a 300mm chamber temperature profile in the course of a high aspect ratio Etch process, working at very significant RF electricity disorders (~3.8kW). The persuasive elements of this knowledge set are:
LAUDA-Noah is Conference these new issues and has incorporated Electrical power conserving engineering in devices that are pleasant to the ecosystem and also have a low price to operate.
The data set Here's from the 200mm volume generation wafer fab and Evidently illustrates the advantage of the LAUDA-Noah POU program.
much more than ever, shrinking machine geometries, demanding new procedures plus a very competitive natural environment call for temperature Manage units that Merge quick and exact temperature Command having an emphasis on diminished operating prices and improved reliability.
the truth is usually here that genuine Dynamic Temperature Regulate can only be reached when all 5 (five) of the next system layout and set up demands are fulfilled:
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We demand significantly less cooling/heating ability for a similar application like a static TCU as a result of our smaller reservoir volume.
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